Combined heat sink multi-configuration processor memory substrate device

ABSTRACT

A Multi-configuration Processor-Memory device for coupling to a PCB (printed circuit board) interface. The device comprises a substrate that supports multiple configurations of memory components and a processor while having a single, common interface with a PCB interface of a printed circuit board. In a first configuration, the substrate supports a processor and a first number of memory components. In a second configuration, the substrate supports a processor and an additional number of memory components. The memory components can be pre-tested, packaged memory components mounted on the substrate. The processor can be a surface mounted processor die. Additionally, the processor can be mounted in a flip chip configuration, side-opposite the memory components. In the first configuration, a heat spreader can be mounted on the memory components and the processor to dissipate heat. In the second, flip chip, configuration, the processor face can be soldered onto a non-functional area of the PCB interface of the printed circuit board to dissipate heat.

This Application is a Divisional of U.S. patent application Ser. No.10/197,385, filed Jul. 16, 2002, entitled “A MULTI-CONFIGURATIONPROCESSOR-MEMORY SUBSTRATE DEVICE” to Behdad Jafari, which is herebyincorporated herein in its entirety.

FIELD OF THE INVENTION

The field of the present invention pertains to electronic integratedcircuits. More particularly, the present invention relates to printedcircuit board devices.

BACKGROUND OF THE INVENTION

Digital computer systems are being used today to perform a wide varietyof tasks. Many different areas of business, industry, government,education, entertainment, and most recently, the home, are tapping intothe enormous and rapidly growing list of applications developed fortoday's increasingly powerful computer devices.

Modern computer systems usually feature powerful digital processorintegrated circuit devices. The processors are used to execute softwareinstructions to implement complex functions, such as, for example, 3-Dgraphics applications, voice recognition, data visualization, and thelike. The performance of many these applications is directly benefitedby more powerful, more capable processors. Additionally, powerful moderncomputer systems have decreased in cost such that they are moreavailable to an average user than ever before.

A primary characteristic of the increasing power of modern computersystems and their decreasing cost is the steady progress of integratedcircuit device manufacturing technologies. Modern semiconductormanufacturing technologies lead to increasing levels of integration,increasing power, and decreasing cost of the computer devices (e.g.,laptop computer systems, desktop computer systems, workstations,servers, etc.).

Computer system device manufacturers have discovered that compact sizeis a desirable market trait. Typically, the more compact a device is,the lower its costs of manufacture. Additionally, compact size (e.g.,increasing integration) yields a number of other benefits, such asdecreased power consumption and increased portability. Accordingly, aprimary objective of many computer system device manufacturers is toreduce the form factor of a given device while maintaining, or evenincreasing, the performance of the device.

The objective of reducing computer system device form factor has led toseveral prior art integrated circuit packaging schemes. One prior artpackaging scheme involves the implementation of multichip modules. Amultichip module, or MCM, refers to a chip package that contains two ormore “raw” chips closely connected with high-density lines, or signaltraces embedded within, or on, the package. A raw chip generally refersto a semiconductor integrated circuit die without its associatedpackaging. The raw chips are typically mounted directly on or embeddedwithin a base. A prior art MCM implementation saves space and can attimes speed processing due to short leads between chips (e.g., incomparison to several discrete chips mounted conventionally on a printedcircuit board). A ceramic base is typically used with chips wire bondedtogether (MCM-C) or with deposited thin film interconnects (MCM-D). MCMshave been mounted onto silicon substrates (MCM-S) and resin-based,laminated printed circuit boards (MCM-L), the latter, less-costlyversion evolving into the multichip module (MCP).

Another prior art packaging scheme involves the implementation ofmultichip packages. A multichip package, or MCP, refers to a chippackage that contains two or more packaged chips, as supposed to rawchips. It is essentially an MCM that uses a laminated,printed-circuit-board-like substrate (MCM-L) rather than ceramic(MCM-C).

However, there are a number of problems with the above prior artpackaging implementations. With both MCMs and MCPs, it is very difficultto route signal traces through the base or the substrate. For example,modern processor integrated circuit dies can have 500 or moreinterconnects which need to be coupled and routed through the substrate.In an MCM or MCP having a number of such dies, the routing problem canbe very substantial.

Other problems arise from the increasing complexity forced upon thedesign of the substrate. The routing problem causes the design of thesubstrate to be much more complex. For example, to route thousands ofdifferent traces, many substrates are implemented in multiple layers andlayout traces a tightly packed manner, which can, in turn, cause anotherset of problems (e.g., crosstalk, uneven path delay, etc.).Additionally, highly complex substrates are difficult to manufacture.For example, high-performance MCMs mounting multiple chips haveextremely tight manufacturing tolerances. The tight tolerances decreasethe yield and reliability of the MCM. This increases the cost of theresulting computer system device. Another factor the increase cost isthe use of raw chips. The raw chips must typically be mounted on thesubstrate and the device essentially finished prior to testing. Thus,difficult to detect defective dies prior to device completion. Thisanother factor that lowers yield.

Another problem with prior art MCM and MCP packaging implementations isthe fact that with compactly packaged MCM/MCP devices, it becomes verydifficult to manage heat dissipation. It is more difficult toeffectively remove heat from the multiple chips. Additionally, thedevice can be thermally unbalanced wherein heat can spread from “hot”components to “cool” components, affecting their performance andreliability. To substrates or ceramic bases of devices are not a verygood heat conductors. Consequently, prior art MCM/MCP devices canrequires complex heat sink apparatuses to maintain high performancelevels. Most of the waste heat is required to transfer into the ambientair (e.g., requiring heat pipes, high air flow, noisy fans, etc.). Ascomponent packaging density increases and clock speed increases, thethermal energy that must be dissipated also increases. To maintainhigh-performance, stable operating temperature must maintained.Accordingly, prior art MCM/MCP devices must be configured for use withelaborate heat dissipation devices (e.g., heat sink fans, liquidcooling, heat spreaders, etc.). This increases the size of the overallpackage and can counteract a primary benefit of using an MCM/MCP design.

Thus, what is required is a solution that efficiently packages multipleintegrated circuit components while maintaining cost effective packagingspecifications. What is required is a solution that evidences favorableyield and performance characteristics along with a small packagefootprint.

SUMMARY OF THE INVENTION

Embodiments of the present invention provided a multi-configurationprocessor-memory device having a standardized interface for coupling toa printed circuit board. Embodiments of the present invention provide asolution that efficiently packages multiple integrated circuitcomponents while maintaining cost effective packaging specifications.Additionally, embodiments of the present invention provide favorableyield and performance characteristics along with a small packagefootprint.

In one embodiment, the present invention is implemented as aMulti-configuration Processor-Memory device for coupling to a PCBinterface of a printed circuit board. The device comprises a substratethat supports multiple configurations of memory components and aprocessor while having a single, common interface for connecting to aninterface area of a printed circuit board (e.g., in one embodiment, asolder pad array disposed on the surface of the printed circuit board).In a first configuration, the substrate supports a processor and a firstnumber of memory components. In a second configuration, the substratesupports a processor and an additional number of memory components. Thememory components can be pre-tested, packaged memory components mountedon the substrate. The processor can be a surface mounted (or wirebonded) processor die. Additionally, the processor can be mounted in aflip chip configuration, side-opposite the memory components. In thefirst configuration, a heat spreader can be mounted on the memorycomponents and the processor to dissipate heat. In the second, flipchip, configuration, the processor face can be soldered onto anon-functional area of the PCB interface of the printed circuit board todissipate heat.

In one embodiment, depending upon the specific configuration, theprocessor can be a GPU (graphics processing unit) and the memorycomponents can be DDR (double data rate) memory components. The GPU canbe a bare die mounted on the substrate, while the memory components arepretested, packaged memory components mounted on the substrate.

In another embodiment, the multi-configuration processor-memory deviceincludes a heat spreader coupled to the memory components to conductheat from the memory components independent of heat from the GPU. TheGPU is mounted on the substrate in a flip chip configuration on a sideof the substrate opposite the memory components. In this embodiment, theGPU includes a heat conduction surface configured for attaching to aheat sink, wherein the heat sink is configured to protrude through anopening of the printed circuit board and conduct heat from the GPUthrough the opening to a side of the printed circuit board opposite theGPU device, thereby conducting heat away from the GPU in a mannerindependent of the memory components.

In this manner, embodiments of the present invention implement aprocessor-memory device having a compact size and small form factorresulting in lower manufacturing cost and much smaller applicationfootprint. High-performance can be maintained since thermal dissipationfrom the memory components and the processor is decoupled, allowinghigher clock speeds and more uniform heat dissipation. Additionally, theuse of pretested prepackaged memory components increases yield of thedevice fabrication process.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention is illustrated by way of example, and not by wayof limitation, in the figures of the accompanying drawings and in whichlike reference numerals refer to similar elements and in which:

FIG. 1 shows a first configuration and a second configuration of aprocessor-memory device in accordance with one embodiment of the presentinvention.

FIG. 2 shows a side view of the first configuration (configuration A)and the second configuration (configuration B) of themulti-configuration processor-memory device in accordance with oneembodiment of the present invention.

FIG. 3A shows a side view of the substrate of configuration B withrespect to the common PCB interface of a PCB (printed circuit board) inaccordance with one embodiment the present invention.

FIG. 3B shows a down view of the common PCB interface in accordance withone embodiment of the present invention.

FIG. 4 shows a close-up side view of the solder interconnections betweensubstrate and the common PCB interface in accordance with one embodimentof the present invention.

FIG. 5A shows a first side view of the solder interactions between thesubstrate, the flip-chip mounted processor, and the common PCB interfacein accordance with one embodiment of the present invention.

FIG. 5B shows a second side view of the solder interactions between thesubstrate, the flip-chip mounted processor, and the common PCB interfacein accordance with one embodiment of the present invention.

FIG. 6 shows a side view of an alternative embodiment wherein the solderballs are used for electrical interconnections and wherein an adhesivelayer is used to attach the processor to the nonfunctional area of thecommon PCB interface.

FIG. 7 shows the solder pads of the nonfunctional area of the common PCBinterface disposed in a grid-like fashion in accordance with oneembodiment of the present invention.

FIG. 8 shows a side view of the grid on the surface of the nonfunctionalarea in accordance with one embodiment of the present invention.

FIG. 9 shows a side view of the solder balls and the grid on the surfaceof the nonfunctional area in accordance with one embodiment of thepresent invention.

FIG. 10 shows a processor-memory device implementation in accordancewith an alternative embodiment of the present invention, wherein aflip-chip configuration of the processor-memory device is mounted to aheat sink that is designed to attach to the processor through an openingwithin a PCB.

DETAILED DESCRIPTION OF THE INVENTION

Reference will now be made in detail to the preferred embodiments of thepresent invention, examples of which are illustrated in the accompanyingdrawings. While the invention will be described in conjunction with thepreferred embodiments, it will be understood that they are not intendedto limit the invention to these embodiments. On the contrary, theinvention is intended to cover alternatives, modifications andequivalents, which may be included within the spirit and scope of theinvention as defined by the appended claims. Furthermore, in thefollowing detailed description of embodiments of the present invention,numerous specific details are set forth in order to provide a thoroughunderstanding of the present invention. However, it will be recognizedby one of ordinary skill in the art that the present invention may bepracticed without these specific details. In other instances, well-knownmethods, procedures, components, and circuits have not been described indetail as not to unnecessarily obscure aspects of the embodiments of thepresent invention.

Embodiments of the present invention provided a multi-configurationprocessor-memory device having a standardized interface for coupling toa printed circuit board. Embodiments of the present invention provide asolution that efficiently packages multiple integrated circuitcomponents while maintaining cost effective packaging specifications.Additionally, embodiments of the present invention provide favorableyield and performance characteristics along with a small packagefootprint.

FIG. 1 shows a first configuration and a second configuration of aprocessor-memory device in accordance with one embodiment of the presentinvention. As shown in FIG. 1, the first configuration, configuration A,includes a processor 130 and a plurality of memory components 121-124mounted on a substrate 110. The second configuration, configuration B,includes a processor 150 and a plurality of memory components 141-142mounted on a substrate 120. Configuration A and configuration B are bothdesigned to mount on a common PCB interface 160.

Referring still FIG. 1, embodiments of the present invention aredesigned to utilize a configurable substrate that is adapted to supportmultiple combinations and mounting configurations of processors andmemory components while still maintaining a common interface to, forexample, an interface area of a printed circuit board (e.g.,motherboard, etc.). As shown in FIG. 1, configuration A has four memorycomponents 121-122 and a single processor 130. Configuration B has 2memory components 141-142 and a single processor 150. Bothconfigurations utilize a common substrate interface that is designed tocouple to the common PCB interface 160.

In one embodiment, the memory components 121-122 and 141-142 areprepackaged memory components. As used herein, the term prepackagedrefers to the fact that the memory components are not bare dies, or rawchips. The memory components are packaged in the conventional fashionand are tested prior to being mounted on the substrate 110 or thesubstrate 120. The use of prepackaged pretested memory componentsincreases the yield of the overall device fabrication process incomparison to prior art MCM or MCP devices which utilize raw chips.Additionally the use of prepackaged memory components simplifies theiracquisition process. For example, prepackaged memory components can bepurchased from a greater number of vendors, providing better flexibilitywith respect to price and/or quality.

In the configuration A and B embodiments shown in FIG. 1, the memorycomponents are surface mounted on the substrate 110 or 120. Inconfiguration B, the processor 150 is surface mounted on the substrate120 along with the memory components. In configuration A, the processor130 is mounted on the substrate 110 in a flip-chip configuration, asshown by the dotted lines showing the outline of the processor 130.

In one embodiment, the processors 130 and 140 are GPUs (graphicsprocessor units). In other embodiments, the processors 130 and 140 areother types of processors, such as, for example, DSPs (digital signalprocessors), CPUs (central processing units), or the like. Similarly, inone embodiment, the memory components 121-124 and 141-142 are DDR memorycomponents. In other embodiments, the memory components 121-124 and141-142 or other types of memory components, such as, for example, RDRAMmemory components, SDRAM memory components, or the like.

FIG. 2 shows a side view configuration A and B of themulti-configuration processor-memory device in accordance with oneembodiment of the present invention. As shown in FIG. 2, inconfiguration B, the processor 150 is surface mounted on the same sideof the substrate 120. In configuration A, the processor 130 is mountedon the substrate 110 in a flip-chip configuration. In configuration A,the memory components 121-124 are surface mounted on the substrate whilethe processor 130 is flip-chip mounted on the side of the substrateopposite the memory components.

The flip-chip mounting of the processor 130 in configuration A providesan increased component density and smaller form factor. By flip-chipmounting the processor 130 on the side opposite the memory components,an additional number of memory components can be included within thesame form factor. Similarly, for a given number of components, a smallerform factor can be implemented, having a smaller application footprint.The smaller form factor and increased component density leads to reducedmanufacturing costs.

The flip-chip mounting of the processor 130 in configuration A allowsthe processor 130 to be cooled independently of the memory components121-124. For example, the memory components 121-124 can be coupled totheir own respective heat spreader or heat sink device. The processor130 on the opposite side of the substrate 110 can utilize its own heatdissipation mechanism. This feature described in greater detail below.

FIG. 3A shows a side view of the substrate 120 of configuration B withrespect to the common PCB interface 160 of a PCB (printed circuit board)170. As described above, both configurations of the processor-memorydevice of the present embodiment include an interface designed to coupleto the common PCB interface 160. The common PCB interface 160 functionsby providing the electrical interconnection to the PCB 170. Theattachment between the interface of substrate 120 and the common PCBinterface 160 is typically implemented using solder. The common PCBinterface can comprise a solder pad array for accepting solderinterconnections with the substrate 120.

It should be noted that in this embodiment, the common PCB interface 160is shown being generally flush with, or the same height as, the surfaceof the PCB 170. In other embodiments, the common PCB interface 160 canbe at a different height than the surface of the PCB 170, for example,slightly raised with respect to the surface of the PCB 170 as shown inFIG. 5 and FIG. 6 below.

FIG. 3B shows a down view of the common PCB interface 160 in accordancewith one embodiment of the present invention. As shown in FIG. 3B, thecommon PCB interface 160 includes a solder pad array for accepting aplurality of solder interconnections (e.g., hundreds ofinterconnections) of the processor-memory device. In this embodiment,the common PCB interface 160 includes a nonfunctional area 165 locatedat the center of the solder pad array. The nonfunctional area 165 refersto the fact that there are no solder pad interconnections in this areawhich are electrically active or used by components on the PCB 170.

FIG. 4 shows a close-up side view of the solder interconnections betweensubstrate 120 and the common PCB interface 160 of the PCB 170 inaccordance with one embodiment of the present invention. As known bythose skilled in the art, a plurality of solder interconnections 401(e.g., solder balls 401) are used to couple the interface of substrate120 to the solder pads of the common PCB interface 160. Once the solderinterconnections are made, there remains a discrete distance 410 betweenthe substrate 120 and the common PCB interface 160. In a typicalimplementation, the distance 410 is approximately 500 microns. Thisdistance is sufficient to accommodate a flip chip mounted processorconfiguration as shown below in FIG. 5.

FIG. 5 shows a side view of the solder interactions between thesubstrate 110, the flip-chip mounted processor 130, and the common PCBinterface 160 in accordance with one embodiment of the presentinvention. FIG. 5 shows the solder interconnection of a configuration Aembodiment of the processor-memory device.

In this embodiment, the plurality of solder balls 401 are used toconnect the interface of the substrate 110 to the common PCB interface160 in a manner similar to the connection between substrate 120 andcommon PCB interface 160 described above in FIG. 4. However, in additionto the solder balls 401 implementing electrical interconnections betweenthe interface and the common PCB interface 160, the solder balls 401also attach the surface of the processor 130 to the nonfunctional area165 of the common PCB interface 160. In this embodiment, the surface ofthe processor 130 is soldered directly to the nonfunctional area 165 toprovide a heat conduction path, thereby enabling heat to be conducteddirectly away from the processor 130 into the common PCB interface 160and the PCB 170.

In this manner, a surface of the processor 130 is configured for anattachment to the PCB interface 160 of the print circuit board in orderto conduct heat from the processor through the attachment. In thisembodiment, the attachment is a solder attachment. The distance 410(e.g., approximately 500 microns) provides more than sufficient roombetween the interface of the substrate 110 and the PCB interface 160 forthe flip-chip mounted processor 130.

The solder attachment shown in FIG. 5 allows the solder balls 401 toconduct most of the heat from the processor 130 directly into the PCB170. This provides a heat conduction path for the processor 130independent of the memory components. The independent heat conductionpaths thermally decouple the memory components from processor allowingseparate heat dissipation paths therefore resulting in more uniformlycontrolled low junction temperatures in all the mounted integratedcircuit devices. Additionally, the PCB interface 160 is shown in FIG. 5and FIG. 6 as being slightly raised above the surface of the PCB 170, incomparison to the flush, co-planar arrangement depicted in FIG. 3A.

FIG. 6 shows a side view of an alternative embodiment wherein the solderballs 401 are used for electrical interconnections and wherein anadhesive layer 601 is used to attach the processor 130 to thenonfunctional area 165 of the common PCB interface 160. The embodimentdepicted in FIG. 6 is substantially similar to the embodiment shown inFIG. 5, except a thermal adhesive layer 601 is used to attach a surfaceof the processor 130 and thereby implement a heat conduction path, asopposed to solder. As with the embodiment shown in FIG. 5, the thermaladhesive layer 601 provides the independent heat conduction path for theprocessor 130.

FIG. 7, FIG. 8, in FIG. 9 show more detailed views of the nonfunctionalarea 165 of the common PCB interface 160 in accordance with oneembodiment of the present invention. As depicted in FIG. 7, the solderpads of the nonfunctional area 165 are disposed in a grid-like fashion.In this embodiment, the grid is implemented to prevent to solder balls401, used to connect the surface of the processor 130, from spreadingand possibly detaching from the surface of the processor 401.

Referring to FIG. 8, a side view of the grid on the surface of thenonfunctional area 165 is shown. FIG. 8 also shows a surface 131 of theprocessor 130 that is configured to attach to the nonfunctional area165. In one embodiment, the surface 131 is a metallized surface (e.g.,copper, etc.) adapted to facilitate the conduction a heat away from theprocessor 130. Alternatively, the surface 131 can be a bare die surface.

Referring to FIG. 9, a side view of the solder balls 401 and the grid onthe surface of the nonfunctional area 165 is shown. As described above,the grid is implemented to prevent solder balls 401 from spreading andpossibly detaching from the surface 131 of the processor 130.

In one embodiment, the grid is implemented using a “silkscreen”material. The silkscreen material can be applied to the surface of thenonfunctional area 165, and thereby implement the grid pattern, duringthe same manufacturing step as other silkscreen features are implementedon the surface of the PCB 170. Alternatively, in another embodiment, thegrid can be implemented by etching the surface of the nonfunctional area165.

FIG. 10 shows a processor-memory device implementation in accordancewith an alternative embodiment of the present invention. In thisembodiment, a flip-chip configuration (e.g., configuration A) of theprocessor-memory device is mounted to a heat sink 1025 that is designedto attach to the processor 130 through an opening (e.g., hole) within aPCB 1070.

In this embodiment, the multi-configuration processor-memory deviceincludes a heat spreader 1020 coupled to the memory components toconduct heat from the memory components independent of heat from theprocessor 130. The processor 130 is mounted on the substrate in aflip-chip configuration on a side of the substrate opposite the memorycomponents. In this embodiment, the processor 130 includes a heatconduction surface configured for attaching to the heat sink 1025. Theheat sink 1025 is configured to protrude through an opening of the 1070and conduct heat from the processor 130 through the opening to a side ofthe PCB 1070 opposite the processor 130 device, thereby conducting heataway from the processor 130 in a manner independent of the memorycomponents (which use the heat spreader 1020). The surface of theprocessor is mounted to the heat sink 1025 as opposed to thenonfunctional area 165 of the common PCB interface 160. The electricalinterconnections of the common PCB interface 160 would be disposed alongthe periphery of the opening within the PCB 1070.

This embodiment provides the advantage of a very robust heat transferdevice (e.g., heat sink 1025) coupled to the processor 130. This allowsthe processor 130 to generate a much greater amount heat than otherwisepossible, thereby allowing higher clock speeds, greater performance, andthe like. The heat sink 1025 can optionally include a fan to increaseairflow, thereby dissipating an even greater amount heat from theprocessor 130.

Thus, embodiments of the present invention provide a multi-configurationprocessor-memory device having a standardized interface for coupling toa printed circuit board. Embodiments of the present invention provide asolution that efficiently packages multiple integrated circuitcomponents while maintaining cost effective packaging specifications.Additionally, embodiments of the present invention provide favorableyield and performance characteristics along with a small packagefootprint. Embodiments of the present invention implement aprocessor-memory device having a compact size and small form factorresulting in lower manufacturing cost and much smaller applicationfootprint. High-performance can be maintained since thermal dissipationfrom the memory components and the processor is decoupled, allowinghigher clock speeds and more uniform heat dissipation. Additionally, theuse of pretested prepackaged memory components increases yield of thedevice fabrication process.

The foregoing descriptions of specific embodiments of the presentinvention have been presented for purposes of illustration anddescription. They are not intended to be exhaustive or to limit theinvention to the precise forms disclosed, and obviously manymodifications and variations are possible in light of the aboveteaching. The embodiments were chosen and described in order to bestexplain the principles of the invention and its practical application,to thereby enable others skilled in the art to best utilize theinvention and various embodiments with various modifications as aresuited to the particular use contemplated. It is intended that the scopeof the invention be defined by the claims appended hereto and theirequivalents.

What is claimed is:
 1. A Multi-configuration GPU (graphics processorunit) device for coupling to a printed circuit board comprising: asubstrate having a first configuration and a second configuration,wherein the substrate is configured for mounting a number of memorycomponents in the first configuration, and mounting a GPU in the secondconfiguration; a common interface built into the substrate for couplingto a PCB (printed circuit board) interface of a printed circuit board,wherein the common interface is configured to provide a standardizedinterconnection to the PCB interface for both the first configurationand the second configuration; a heat spreader coupled to the memorycomponents to conduct heat from the memory components independent ofheat from the GPU; and wherein the GPU is mounted on the substrate in aflip chip configuration on a side of the substrate opposite the memorycomponents, and wherein the GPU includes a heat conduction surfaceconfigured for attaching to a heat sink, wherein the heat sink isconfigured to protrude through an opening of the printed circuit boardand conduct heat from the GPU through the opening to a side of theprinted circuit board opposite the GPU device, and wherein the memorycomponents are surface mounted on the substrate and do not overlap withthe GPU.
 2. The device of claim 1 wherein the memory components aresurface mounted on the substrate using solder.
 3. The device of claim 1,wherein the memory components are surface mounted on the substrate. 4.The device of claim 1 wherein the processor has a ball grid array formounting on the substrate.
 5. The device of claim 1 wherein the memorycomponents are DDR (double data rate) memory components.
 6. The deviceof claim 5 wherein the memory components are packaged memory components.7. The device of claim 1 wherein the processor is mounted near theinterface of the substrate.
 8. The device of claim 7 wherein a surfaceof the processor is configured for an attachment to an area of the PCBinterface of the print circuit board to conduct heat from the processorthrough the attachment.
 9. The device of claim 8 wherein the attachmentis a solder attachment.
 10. The device of claim 1 wherein the memorycomponents are surface mounted memory components configured to receivethe heat spreader to conduct heat from the memory components.